![]() ![]() However, 3D-ICs also introduce new challenges in terms of Multiphysics that need to be addressed during the design process. Read more about this extraordinary technology by downloading this white paper about Pre-Silicon Hardware Security.Īnsys Hardware Security Solution with Pre-Silicon SideChannel Leakage Analysis | White PaperĢ.5D/3D-IC is the trending topic in the Semiconductor industry as they allow for higher circuit densities, better performance, and reduced power consumption compared to traditional 2D-ICs. To mitigate this risk, Side Channel Leakage Analysis (SCLA) should be used to analyze potential side-channel attacks, such as those that exploit power consumption, electromagnetic radiation, and thermal emissions.Īnsys #Multiphysics simulation platform enables chip designers to predict and quantify side-channel vulnerabilities during the #semiconductor design phase. These advancements rely on a network of ubiquitous devices that communicate with each other through the Internet.Īlthough cryptography is used to secure information and provide data privacy, vulnerabilities in the hardware implementation can compromise its effectiveness. ![]() The advent of IoT technology has led to the development of smart homes and smart cities, making daily life more convenient than ever before. Learn more about the capabilities and features of Totem/Totem-SC by downloading its datasheet. #Ansys Totem-SC, a cloud-native version of Totem based on SeaScape, offers ultra-high speed and capacity to handle even the largest full-chip analyses. It has been certified by major foundries for finFET nodes down to 2nm and has an impressive track record of thousands of tapeouts. ![]() Analyzing EM and IR on complex analog circuits, along with monitoring digital noise, presents a significant challenge for power integrity sign-off.Īnsys Totem is a gold standard and trusted industry-leading solution for voltage drop and electromigration #multiphysics sign-off of transistor-level and mixed-signal designs. This is crucial for mixed-signal designs that integrate both analog and digital circuits. Validating the power integrity of a design requires strategic analysis of both Electromigration (EM) and voltage drop (IR) to ensure that every device on the chip receives the required current. ![]()
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